Industrial scale CMP modeling

Following the laboratory scale philosophy of polishing one wafer at a time, is very expensive at an industrial scale. The amount of time, and the consumables required to judiciously tailor the process makes it impossible to use a simple bench top polisher. Again, the particle augmented mixed lubrication (PAML) approach is being employed to model the complex multi-component interaction and the resulting variation in material removal. Oscillating-carrier polishers, which try to replicate the motion of a wafer in an industrial polisher, are also studied.   Industral scale CMP modeling
PFTL Research Assistant(s):   Gagan Srivastava
Method(s) Employed:   Conductive Heat Transfer, Convective Heat Tranfer, Flash Heat Generation, Mixed Lubrication Modeling
Rig(s) and/or Software(s) Employed:   MATLAB, Mathematica, Paraview, QtiPlot

Sample Results:



Select PFTL References:

Srivastava, G., and Higgs III, C. F., "The Thermal Effects of CMP as a Particle Augmented Mixed Lubrication Tribosystem", Materials Research Society Symposium Proceedings, 2013